Amazon is planning a bond sale that will raise at least $25 billion, according to people familiar with the matter. The company disclosed the financing move in a filing with the U.S. Securities and Exchange Commission, though it did not include the size of the offering in that document.
People familiar with the transaction said Amazon has told underwriters it does not intend to return to the debt market again in 2026. Bloomberg first reported the size of the planned sale. CNBC reported that the offering is structured as an eight-part deal.
Funding AI infrastructure and corporate needs
The latest borrowing comes as Amazon continues to spend heavily on artificial intelligence infrastructure. The company has projected capital expenditures of $200 billion this year, up from $131 billion in 2025, with much of that spending aimed at data centers, chips and related equipment.
Amazon has already tapped debt markets several times this year, including roughly $54 billion in bond sales in the U.S. and Europe, a $10 billion offering in Canada in June and a $15 billion U.S. bond sale in November. A company spokesperson said the proceeds from the new offering will be used for general corporate purposes, which may include investment support, future capital spending and debt repayment.
Source: cnbc.com
